Infineon and Qualcomm Partner on Safety Microcontroller Subsystem
Infineon and Qualcomm have agreed to develop a microcontroller-based safety subsystem for Snapdragon Ride platforms, targeting central computers in software-defined vehicles.
Infineon Technologies and Qualcomm have signed an agreement to develop a microcontroller-based subsystem for Snapdragon Ride automotive compute platforms. The November 2, 2026, partnership aims to accelerate the deployment of centralized car computers in software-defined vehicles by pairing Qualcomm's high-performance systems-on-chip with Infineon's hardware and software for safety management, connectivity, and memory management.
The collaboration focuses on a reference design for a functional safety controller. This subsystem is intended for central processing units in software-defined vehicles.
Technical Integration
The hardware architecture integrates Infineon's AURIX microcontroller and OPTIREG power management ICs with Qualcomm's Snapdragon Ride and Ride Flex systems-on-chip. Infineon is supplying a dedicated software package that pre-integrates microcontroller firmware with specific monitoring software tailored to Qualcomm's platform requirements. The agreement also includes Infineon's BRIGHTLANE Automotive Ethernet and USB connectivity solutions and SEMPER NOR Flash memory, which is certified for the Snapdragon platform. The interface standardizes connections to vehicle networks, including controller area network and Ethernet links.
Functional Safety Focus
The reference design enables real-time safety functions through a controller managing diagnostics and failsafe procedures for safety-critical driving activities. Infineon's MCU subsystem provides system health monitoring, safety mechanism coordination, and real-time control for critical safety functions. It operates alongside the Snapdragon platforms, coordinating AI and high-performance computing capabilities with vehicle behavior.
Infineon automotive division president Peter Schiefer stated that the collaboration reflects a fundamental approach to centralized vehicle computing. He said the components need to work together seamlessly to enable safe vehicle operation and that Infineon provides essential functional building blocks and integration expertise for the trust foundation for software-defined vehicles leveraging AI.
Trade Show Showcase
Infineon will demonstrate the integrated hardware and software solution at the electronica trade fair in Munich from November 10 to 13, 2026. The Germany-based company recently completed the acquisition of ams Osram Group’s non-optical analogue and mixed-signal sensor portfolio. Infineon has also entered a partnership with MediaTek to develop an AI-driven in-cabin solution for future vehicles, and MediaTek qualified Infineon’s 512Mb quad SPI NOR Flash for use in its Dimensity Auto Cockpit platform.
The joint integration will be showed at the electronica trade fair in Munich from November 10 to 13, 2026.
